Advantages of silicone-based thermally conductive resin
Compared with non-silicone systems, there is a reduction in heat after various reliability tests blocking effect.
Different products can be selected according to film thickness
Through film adjustment to reduce thermal resistance - G-OOO series
When you need to use a thick film - choose CLG, SDP series
|
Product Name |
G-OOO Series |
CLG series |
SDP series |
|
|
Type |
Single component type |
two-component type |
||
|
Features |
Non-curing |
curing type (condensation, addition) |
Non-curing |
curing type (additional) |
|
use film |
filler |
|||
Cured thermal grease
|
|
|
G-1000 |
G-789 |
GUV-300 |
|
Type |
|
Single groupparts hardened( Contraction Combined/ Depropanketone ) |
Single Groupparts hardened( Additional) |
Single Groupparts hardened( UV hardening) |
|
OuterView |
|
white |
white |
white |
|
Viscosity ( Pa-s) |
Pa- s |
80 |
130 |
154 |
|
standard quasi curing condition |
|
23℃ ×50%×7days |
125℃ ×90min |
6,000mJ (365nm)+25℃×24h |
|
curing After density: 23℃ |
|
3.0 |
3.1 |
3 |
|
Hardness |
Asker C |
40 |
10 |
Modulus 39 kPa.s |
|
Heat conduction rate |
W/ m-k |
2.4 |
3.0 |
3.1 |
|
BLT |
μm |
50 |
25 |
- |
|
Hot Block |
mm2- K/W |
29 |
11 |
- |
|
click WearVoltage |
kV/ mm |
14 |
14 |
- |
Hardness
Asker C
40
10
Modulus 39 kPa.s
Heat conduction rate
W/ m-k
2.4
3.0
3.1
BLT
μm
50
25
-
Hot Block
mm2- K/W
29
11
-
click WearVoltage
kV/ mm
14
14
-
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